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Part NO
Wafer

Size

(mm)
Gross

Die

EA
Ensure

Yield
ID

(A)
VDss

(V)
VGss

(V)
VGS(th)

(V)
ESD
FRED
CP spec

RDSON _Vgs=10V

Max(Ω)
Package spec

RDSON _Vgs=10V

Typ(Ω)


Package spec

RDSON _Vgs=10V

Max(Ω)
Chip

Size

(um2)
Bond

Area

(um2)
File
Name
CM16N60FED
200
2200
95%
16
600
±30
2~4
V
V
0.27
0.21
0.234
3515 X 3531
340 X 480
CM20N600ED
200
1770
95%
20
600
±30
2~4
V
N/A
0.194
0.151
0.169
3911 X 3911
200 X 130
CM20N60FED
200
1770
95%
20
600
±30
2~4
V
V
0.21
0.159
0.178
3911 X 3911
200 X 130
CM25N600ED
200
1050
95%
25
600
±30
2~4
V
N/A
0.128
0.099
0.111
4919 X 5051
350 X 450
CM25N60FED
200
1050
95%
25
600
±30
2~4
V
V
0.134
0.104
0.117
4919 X 5051
350 X 450
CM38N60FED
200
820
95%
38
600
±30
2~4
V
V
0.097
0.075
0.084
5975 X 5161
350 X 450
CM75N600ED
200
430
93%
75
600
±30
2~4
V
N/A
0.045
0.035
0.039
8027 X 7421
340 X 480
CM75N60FED
200
430
93%
75
600
±30
2~4
V
V
0.048
0.037
0.041
8027 X 7421
340 X 480
CM80N600ED
200
312
93%
80
600
±30
2~4
V
N/A
0.032
0.025
0.028
11135 X 7421
350 X 450
CM80N60FED
200
312
93%
80
600
±30
2~4
V
V
0.033
0.026
0.029
11135 X 7421
350 X 450
CM01N650ED
200
29369
95%
1
650
±30
2~4
V
N/A
11.6
9
10
995 X 981
152 X 220
CM01N65FED
200
29369
95%
1
650
±30
2~4
V
V
12.2
9.44
10.6
995 X 981
152 X 220
CM02N650ED
200
19329
95%
2
650
±30
2~4
V
N/A
4.9
3.8
4.3
1223 X 1221
152 X 220
CM02N65FED
200
19329
95%
2
650
±30
2~4
V
V
5.2
4
4.5
1223 X 1221
152 X 220
CM03N650ED
200
12950
95%
3
650
±30
2~4
V
N/A
2.8
2.2
2.5
1491 X 1478
190 X 150
CM04N650ED
200
10560
95%
4
650
±30
2~4
V
N/A
1.94
1.5
1.68
1631 X 1646
152 X 220
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