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Part NO
Wafer

Size

(mm)
Gross

Die

EA
Ensure

Yield
ID

(A)
VDss

(V)
VGss

(V)
VGS(th)

(V)
ESD
FRED
CP spec

RDSON _Vgs=10V

Max(Ω)
Package spec

RDSON _Vgs=10V

Typ(Ω)


Package spec

RDSON _Vgs=10V

Max(Ω)
Chip

Size

(um2)
Bond

Area

(um2)
File
Name
CM04N65FED
200
10560
95%
4
650
±30
2~4
V
V
2.1
1.57
1.76
1631 X 1646
152 X 220
CM05N650ED
200
8231
95%
5
650
±30
2~4
V
N/A
1.3
1
1.12
1907 X 1806
152 X 220
CM05N65FED
200
8231
95%
5
650
±30
2~4
V
V
1.35
1.05
1.175
1907 X 1806
152 X 220
CM10N650ED
200
5050
95%
10
650
±30
2~4
V
N/A
0.75
0.59
0.65
2315 X 2371
350 X 450
CM10N65FED
200
5050
95%
10
650
±30
2~4
V
V
0.78
0.61
0.68
2315 X 2371
350 X 450
CM11N650ED
200
4630
95%
11
600
±30
2~4
V
N/A
0.716
0.556
0.623
2099 X 2881
350 X 450
CM11N65FED
200
4630
95%
11
600
±30
2~4
V
V
0.716
0.556
0.623
2099 X 2881
350 X 450
CM13N650ED
200
3700
95%
13
650
±30
2~4
V
N/A
0.544
0.422
0.473
2783 X 2711
350 X 450
CM13N65FED
200
3700
95%
13
650
±30
2~4
V
V
0.569
0.442
0.495
2783 X 2711
350 X 450
CM15N650ED
200
2950
95%
15
650
±30
2~4
V
N/A
0.386
0.3
0.336
3107 X 2881
200 X 130
CM15N65FED
200
2950
95%
15
650
±30
2~4
V
V
0.47
0.37
0.41
3107 X 2881
200 X 130
CM16N650ED
200
2200
95%
16
650
±30
2~4
V
N/A
0.283
0.220
0.246
3515 X 3531
340 X 480
CM16N65FED
200
2200
95%
16
650
±30
2~4
V
V
0.3
0.23
0.258
3515 X 3531
340 X 480
CM20N650ED
200
1770
95%
20
650
±30
2~4
V
N/A
0.216
0.168
0.188
3911 X 3911
200 X 130
CM20N65FED
200
1770
95%
20
650
±30
2~4
V
V
0.227
0.176
0.197
3911 X 3911
200 X 130
CM25N65FED
200
1050
95%
25
650
±30
2~4
V
V
0.15
0.115
0.13
4919 X 5051
350 X 450
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