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Part NO
Wafer

Size

(mm)
Gross

Die

EA
Ensure

Yield
ID

(A)
VDss

(V)
VGss

(V)
VGS(th)

(V)
ESD
FRED
CP spec

RDSON _Vgs=10V

Max(Ω)
Package spec

RDSON _Vgs=10V

Typ(Ω)


Package spec

RDSON _Vgs=10V

Max(Ω)
Chip

Size

(um2)
Bond

Area

(um2)
File
Name
CM38N650ED
200
820
95%
38
650
±30
2~4
V
N/A
0.101
0.079
0.088
5975 X 5161
350 X 450
CM38N65FED
200
820
95%
38
650
±30
2~4
V
V
0.107
0.083
0.093
5975 X 5161
350 X 450
CM75N650ED
200
430
93%
75
650
±30
2~4
V
N/A
0.5
0.039
0.044
8027 X 7421
340 X 480
CM75N65FED
200
430
93%
75
650
±30
2~4
V
V
0.053
0.041
0.046
8027 X 7421
340 X 480
CM80N650ED
200
312
93%
80
650
±30
2~4
V
N/A
0.035
0.027
0.031
11135 X 7421
350 X 450
CM80N65FED
200
312
93%
80
650
±30
2~4
V
V
0.037
0.029
0.032
11135 X 7421
350 X 450
CM10N700ED
200
5050
95%
10
700
±30
2~4
V
N/A
0.820
0.640
0.710
2315 X 2371
350 X 450
CM10N70FED
200
5050
95%
10
700
±30
2~4
V
V
0.860
0.670
0.750
2315 X 2371
350 X 450
CM11N70FED
200
4630
95%
11
700
±30
2~4
V
V
0.825
0.640
0.717
2099 X 2881
350 X 450
CM11N70FED 200
200
4630
95%
11
700
±30
2~4
V
V
0.825
0.640
0.717
2099 X 2881
350 X 450
CM13N700ED
200
3700
95%
13
700
±30
2~4
V
N/A
0.597
0.463
0.519
2783 X 2711
350 X 450
CM13N70FED
200
3700
95%
13
700
±30
2~4
V
V
0.624
0.485
0.543
2783 X 2711
350 X 450
CM15N700ED
200
2950
95%
15
700
±30
2~4
V
N/A
0.424
0.33
0.37
3107 X 2881
200 X 130
CM15N70FED 200
200
2950
95%
15
700
±30
2~4
V
V
0.442
0.345
0.387
3107 X 2881
200 X 130
CM16N700ED
200
2200
95%
16
700
±30
2~4
V
N/A
0.310
0.240
0.270
3515 X 3531
340 X 480
CM16N70FED 200
200
2200
95%
16
700
±30
2~4
V
V
0.330
0.253
0.283
3515 X 3531
340 X 480
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