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Part NO
Wafer

Size

(mm)
Gross

Die

EA
Ensure

Yield
ID

(A)
VDss

(V)
VGss

(V)
VGS(th)

(V)
ESD
FRED
CP spec

RDSON _Vgs=10V

Max(Ω)
Package spec

RDSON _Vgs=10V

Typ(Ω)


Package spec

RDSON _Vgs=10V

Max(Ω)
Chip

Size

(um2)
Bond

Area

(um2)
File
Name
CM20N700ED
200
1770
95%
20
700
±30
2~4
V
N/A
0.237
0.184
0.206
3911 X 3911
200 X 130
CM20N70FED
200
1770
95%
20
700
±30
2~4
V
V
0.248
0.193
0.216
3911 X 3911
200 X 130
CM25N700ED 200
200
1050
95%
25
700
±31
2~5
V
N/A
0.155
0.12
0.135
4919 X 5051
350 X 450
CM25N70FED
200
1050
95%
25
700
±32
2~6
V
V
0.163
0.126
0.141
4919 X 5051
350 X 450
CM38N700ED
200
820
95%
38
700
±30
2~4
V
N/A
0.112
0.087
0.097
5975 X 5161
350 X 450
CM38N70FED
200
820
95%
38
700
±30
2~4
V
V
0.117
0.091
0.102
5975 X 5161
350 X 450
CM75N700ED
200
430
93%
75
700
±30
2~4
V
N/A
0.055
0.043
0.048
8027 X 7421
340 X 480
CM75N70FED
200
430
93%
75
700
±30
2~4
V
V
0.058
0.045
0.050
8027 X 7421
340 X 480
CM80N700ED
200
312
93%
80
700
±30
2~4
V
N/A
0.039
0.030
0.034
11135 X 7421
350 X 450
CM80N70FED
200
312
93%
80
700
±30
2~4
V
V
0.041
0.031
0.035
11135 X 7421
350 X 450
CM05N800ED
200
8600
95%
5
800
±30
2~4
V
N/A
2.576
2
2.24
1799 X 1801
430 X 350
CM21N800ED
200
990
93%
21
800
±30
2~4
V
N/A
0.206
0.16
0.179
5159 X 5231
340 X 480
CM21N80FED
200
990
93%
21
800
±30
2~4
V
V
0.217
0.168
0.188
5159 X 5231
340 X 480
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