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Part NO
Wafer

Size

(mm)
Gross

Die

EA
Ensure

Yield
ID

(A)
VDss

(V)
VGss

(V)
VGS(th)

(V)
ESD
FRED
CP spec

RDSON _Vgs=10V

Max(Ω)
Package spec

RDSON _Vgs=10V

Typ(Ω)


Package spec

RDSON _Vgs=10V

Max(Ω)
Chip

Size

(um2)
Bond

Area

(um2)
File
Name
CM01N500ED
200
33500
95%
1
500
±30
2~4
V
N/A
6.2
4.8
5.4
923 X 929
200 X 130
CM01N50FED
200
33500
95%
1
500
±30
2~4
V
V
6.5
5.1
5.7
923 X 929
200 X 130
CM02N500ED
200
19500
95%
2
500
±30
2~4
V
N/A
2.58
2
2.24
1199 X 1205
200 X 130
CM02N50FED
200
19500
95%
2
500
±30
2~4
V
V
2.7
2.1
2.4
1199 X 1205
200 X 130
CM11N500ED
200
7450
95%
11
500
±30
2~4
V
N/A
0.75
0.58
0.65
1943 X 1941
458 X 345
CM11N50FED
200
7450
95%
11
500
±30
2~4
V
V
0.79
0.61
0.68
1943 X 1941
458 X 345
CM60N5000D
200
830
93%
60
500
±30
2~4
N/A
N/A
0.064
0.05
0.056
5951 X 5671
350 X 450
CM10N600ED
200
5050
95%
10
600
±30
2~4
V
N/A
0.672
0.522
0.584
2315 X 2371
350 X 450
CM10N60FED
200
5050
95%
10
600
±30
2~4
V
V
0.71
0.55
0.616
2315 X 2371
350 X 450
CM11N600ED
200
4630
95%
11
600
±30
2~4
V
N/A
0.645
0.5
0.56
2099 X 2881
350 X 450
CM11N60FED
200
4630
95%
11
600
±30
2~4
V
V
0.68
0.528
0.59
2099 X 2881
350 X 450
CM13N600ED
200
3700
95%
13
600
±30
2~4
V
N/A
0.49
0.38
0.426
2783 X 2711
350 X 450
CM15N600ED
200
2950
95%
15
600
±30
2~4
V
N/A
0.35
0.271
0.3
3107 X 2881
200 X 130
CM15N60FED
200
2950
95%
15
600
±30
2~4
V
V
0.368
0.285
0.32
3107 X 2881
200 X 130
CM16N600ED
200
2200
95%
16
600
±30
2~4
V
N/A
0.255
0.198
0.222
3515 X 3531
340 X 480
CM16N60FED
200
2200
95%
16
600
±30
2~4
V
V
0.27
0.21
0.234
3515 X 3531
340 X 480
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